SolidWorks Flow with Electronic Cooling

The Electronic Cooling Module for SOLIDWORKS Flow Simulation evaluates thermal properties and cooling requirements for standard components.

The module includes both analysis productivity capability and enhanced simulation functionality, giving designers and engineers a great toolset to tackle the tough challenges of electronic packaging.

It includes Electronic Cooling, Fluid Flow Analysis & Electronics Thermal Management.

Introduction – Electronic Cooling Module

Additional Capabilities
  • Joule Heating calculation
  • Heat Pipes for modeling a predominant cooling approach
  • Two-resistor compact model to accurately simulate electronic packages
  • Engineering database with a wide range of new fans, thermoelectric coolers, two-resistor components, interface materials, and typical IC packages
  • PCB Generators to accurately model multilayer PCBs

Electronic Cooling Tools 

  • Fan Selection Optimizing fan selection and placement can have a dramatic impact on the overall thermal performance of a design. 
  • PCB Thermal Simulation Studying the PCB in isolation allows the designer to evaluate component placement, use of heat pipes, thermal pads, and interface materials.
  • Product Thermal Design Overall thermal behavior must be understood to ensure correct product performance, including heat- up/cool-down cycles and maximum temperature under load.
  • Heatsink Selection/Design Selecting the correct heatsink can be crucial in the operational life of the component to be cooled. The correct heatsink can only be determined with knowledge of the overall airflow and the thermal impacts of the components on the PCB. 
  • Airflow Optimization Ensuring the correct volume of cooling flow to all components is a key engineering challenge. Optimizing the airflow can require moving components and/or creating air baffles and ducts.